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STTH806
Turbo 2 ultrafast - high voltage rectifier
Main product characteristics
K
IF(AV) VRRM Tj VF (typ) trr (max) 8A 600 V 175 C 1.1 V 35 ns
A
K
A NC
D2PAK STTH806G
Features and benefits

A K
TO-220AC STTH806D
A K
TO-220AC Ins STTH806DI
Ultrafast switching Low reverse current Low thermal resistance Reduces conduction and switching losses Insulated package TO-220AC Ins - Insulated voltage: 2500 VRMS - Typical package capacitance: 7 pF
Order codes
Part Number STTH806G Marking STTH806G STTH806G STTH806D STTH806DI
Description
The STTH806 uses ST Turbo2 600 V technology. This device is specially suited for use in switching power supplies, and industrial applications. Table 1.
Symbol VRRM IF(RMS) Repetitive peak reverse voltage
STTH806G-TR STTH806D STTH806DI
Absolute ratings (limiting values per diode at 25 C, unless otherwise specified)
Parameter Value 600 TO-220AC, D2PAK RMS forward current TO-220 Ins Average forward current, = 0.5 Tc = 140 C Tc = 120 C TO-220AC, TO-220 Ins D2PAK 24 8 8 90 -65 to + 175 temperature(1) 175 A A A A C C 30 Unit V A
IF(AV) IFSM Tstg Tj
1.
Surge non repetitive forward current tp = 10 ms Sinusoidal Storage temperature range Maximum operating junction
dP tot thermal runaway condition for a diode on its own heatsink 1 -------------- < ------------------------dTj R th ( j - a )
May 2006
Rev 1
www.st.com
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Characteristics
STTH806
1
Table 2.
Characteristics
Thermal parameters
Parameter Junction to case TO-220AC, D2 PAK Value 2.5 4 Unit C/W
Symbol Rth(j-c)
TO-220AC Ins
Table 3.
Symbol IR(1) VF(2)
Static electrical characteristics
Parameter Reverse leakage current Forward voltage drop Test conditions Tj = 25 C Tj = 150 C Tj = 25 C Tj = 150 C VR = VRRM IF = 8 A Min. Typ Max. 8 20 1.10 200 1.85 1.40 Unit A V
1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 %
To evaluate the conduction losses use the following equation: P = 1.07 x IF(AV) + 0.041 IF2(RMS) Table 4.
Symbol
Dynamic characteristics
Parameter Test conditions IF = 0.5 A, Irr = 0.25 A, IR = 1 A, Tj = 25 C IF = 1 A, dIF/dt = -50 A/s, VR = 30 V, Tj = 25 C IF = 8 A, dIF/dt = -100 A/s, VR = 400 V, Tj = 25 C dIF/dt = 100 A/s IF = 8 A VFR = 1.1 x VFmax, Tj = 25 C IF = 8 A dIF/dt = 100 A/s VFR = 1.1 x VFmax, Tj = 25 C 3.5 40 4.5 Min. Typ Max. 35 ns 55 6.5 200 ns V Unit
trr
Reverse recovery time
IRM tfr VFP
Reverse recovery current Forward recovery time Forward recovery voltage
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STTH806
Characteristics
Figure 1.
Conduction losses versus average current
= 0.05 = 0.1 = 0.2 = 0.5
Figure 2.
IFM(A)
Forward voltage drop versus forward current
15.0
PF(AV)(W)
100 90 80
12.5
=1
10.0
70 60
Tj=150C (maximum values)
7.5
50 40
Tj=150C (typical values)
5.0
T
2.5
30 20
Tj=25C (maximum values)
IF(AV)(A)
0.0 0 1 2 3 4 5 6 7
=tp/T
8 9
tp
10
10 0 0.0 0.5 1.0 1.5 2.0
VFM(V)
2.5 3.0 3.5 4.0
Figure 3.
Relative variation of thermal Figure 4. impedance junction to case versus pulse duration
14 12 10 8 6 4 2
Peak reverse recovery current versus dIF/dt (typical values)
1.0 0.9 0.8
Zth(j-c)/Rth(j-c)
Single pulse
IRM(A)
VR=400V Tj=125C IF=IF(AV) IF=0.5 x IF(AV) IF=0.25 x IF(AV) IF=2 x IF(AV)
0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-03 1.E-02 1.E-01 1.E+00
tp(s)
0 0 50 100 150
dIF/dt(A/s)
200 250 300 350 400 450 500
Figure 5.
trr(ns)
Reverse recovery time versus dIF/dt (typical values)
VR=400V Tj=125C
Figure 6.
Qrr(nC)
VR=400V Tj=125C
Reverse recovery charges versus dIF/dt (typical values)
300
450 400 350
IF=2 x IF(AV)
IF=2 x IF(AV)
250
IF=IF(AV)
200
IF=IF(AV)
300
IF=0.5 x IF(AV)
150
250 200
IF=0.5 x IF(AV)
100 150 50 100
0 0 50 100 150
dIF/dt(A/s)
200 250 300 350 400 450 500
dIF/dt(A/s)
0 50 100 150 200 250 300 350 400 450 500
50
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Characteristics
STTH806
Figure 7.
Softness factor versus dIF/dt (typical values)
Figure 8.
Relative variations of dynamic parameters versus junction temperature
2.00 1.80 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 0.00
S factor
IF 2 x IF(AV) VR = 400 V Tj = 125 C
2.50 2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25
IRM QRR
S factor
IF=IF(AV) VR=400V Reference: Tj=125C
dIF/dt(A/s)
0 50 100 150 200 250 300 350 400 450 500
Tj(C)
25 50 75 100 125
0.00
Figure 9.
VFP(V)
IF=IF(AV) Tj=125C
Transient peak forward voltage versus dIF/dt (typical values)
Figure 10. Forward recovery time versus dIF/dt (typical values)
200 180 160
14 12 10 8 6 4 2
tfr(ns)
IF=IF(AV) VFR=1.1 x VF max. Tj=125C
140 120 100 80 60 40
dIF/dt(A/s)
0 0 100 200 300 400 500
20 0 0 100
dIF/dt(A/s)
200 300 400 500
Figure 11. Junction capacitance versus reverse voltage applied (typical values)
C(pF)
F=1MHz VOSC=30mVRMS Tj=25C
Figure 12. Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, eCU = 35 m)
80 70 60 50
100
Rth(j-a)(C/W)
DPAK
10
40 30 20
VR(V)
1 1 10 100 1000
10
S(Cu)(cm)
0 0 5 10 15 20 25 30 35 40
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STTH806
Package mechanical data
2
Package mechanical data
Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.80 Nm Maximum torque value: 1.0 Nm Table 5. D2PAK Dimensions
Dimensions Ref. Millimeters Min.
A E L2
Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126
Max 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20
A
C2
4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40
A1 A2
D
B B2
L L3 A1
C C2
B2 B G C R
D E G
A2
L L2
M
*
V2
L3 M
* FLAT ZONE NO LESS THAN 2mm
R V2
0.40 typ. 0 8
0.016 typ. 0 8
Figure 13. D2PAK Footprint dimensions (in mm)
16.90
10.30 1.30
5.08
8.90
3.70
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Package mechanical data Table 6. TO-220AC Dimensions
Dimensions Ref. Millimeters Min.
H2 OI L5 L7 L6 L2 C A
STTH806
Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409
Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40
A C D E F F1 G
4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00
F1
L9 L4 F
D
H2 L2 L4
M E
16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93
0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154
L5 L6 L7 L9 M Diam. I
G
2.6 typ. 3.75 3.85
0.102 typ. 0.147 0.151
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STTH806 Table 7. TO-220AC Ins Dimensions
Package mechanical data
Dimensions Ref. Millimeters Min. A a1
B OI L F A I4 b2 C
Inches Min. Typ. Max. 0.625 0.147
Typ.
Max.
15.20 3.75 13.00 10.00 0.61 1.23 4.40 0.49 2.40 4.80 6.20 3.75
15.90 0.598
a2 B b1 b2 C
14.00 0.511 10.40 0.393 0.88 0.024 1.32 0.048 4.60 0.173 0.70 0.019 2.72 0.094 5.40 0.189 6.60 0.244 3.85 0.147
0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.212 0.259 0.151
a1 l2
c2
c1 c2 e
a2
M b1 e c1
F OI I4 L l2 M
15.80 16.40 16.80 0.622 0.646 0.661 2.65 1.14 2.60 2.95 0.104 1.70 0.044 0.102 0.116 0.066
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
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Ordering information
STTH806
3
Ordering information
Delivery mode Tube Tape and reel Tube Tube
Part Number STTH806G STTH806G-TR STTH806D STTH806DI
Marking STTH806G STTH806G STTH806D STTH806DI
Package D2PAK D2 PAK
Weight 1.48 g 1.48 g 1.90 g 2.30 g
Base qty 50 1000 50 50
TO-220AC TO-220AC Ins
4
Revision history
Date 18-May-2006 Revision 1 First issue. Description of Changes
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STTH806
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